Invention Grant
- Patent Title: Method and apparatus for measuring phase of transmission line connecting between RF chips
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Application No.: US16177767Application Date: 2018-11-01
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Publication No.: US11171415B2Publication Date: 2021-11-09
- Inventor: Jeongho Lee , Dae Young Lee , Sunggi Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2017-0147853 20171108
- Main IPC: H01Q3/00
- IPC: H01Q3/00 ; H01Q3/26 ; H01Q3/34 ; H04B7/06 ; H03K21/38 ; H04B17/14 ; H04L5/00 ; H04B7/00 ; H04L7/00

Abstract:
The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). An electronic device including a first radio frequency (RF) chip and a second RF chip is provided. The electronic device includes a modem configured to transmit a first clock signal to the second RF chip, the first RF chip connected to the modem and configured to receive a second clock signal from the modem, and the second RF chip electrically connected to the first RF chip through a transmission line and configured to receive the second clock signal from the first RF chip and to measure a phase of the transmission line based on the first clock signal and the second clock signal. The first clock signal and the second clock signal have different frequencies.
Public/Granted literature
- US20190140721A1 METHOD AND APPARATUS FOR MEASURING PHASE OF TRANSMISSION LINE CONNECTING BETWEEN RF CHIPS Public/Granted day:2019-05-09
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