Invention Grant
- Patent Title: Submount for semiconductor laser device on heat assisted recording device
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Application No.: US16779065Application Date: 2020-01-31
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Publication No.: US11171465B2Publication Date: 2021-11-09
- Inventor: Shinichi Ijima , Kazumasa Nagano , Norio Ikedo
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2017-151533 20170804
- Main IPC: H01S5/0237
- IPC: H01S5/0237 ; G11B5/48 ; G11B5/00

Abstract:
A submount includes a substrate, the substrate including: a first surface; a second surface that is perpendicular to the first surface; a third surface that is perpendicular to the first surface and the second surface; a fourth surface that is perpendicular to the first surface and the second surface, and is opposed to the third surface; a fifth surface that is perpendicular to the second surface and the third surface, and is opposed to the first surface; a sixth surface that is opposed to the second surface; a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other; and a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other, the first notch part and the second notch part each having a recessed surface.
Public/Granted literature
- US20200169059A1 SUBMOUNT, SEMICONDUCTOR LASER DEVICE AND HEAT ASSISTED HARD DISK DEVICE Public/Granted day:2020-05-28
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