Invention Grant
- Patent Title: Standoffs with removable spacers
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Application No.: US17048679Application Date: 2018-09-20
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Publication No.: US11181954B2Publication Date: 2021-11-23
- Inventor: Yao-Wen Fan , Yu-Wei Tan , Sheng-Lung Liao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2018/051946 WO 20180920
- International Announcement: WO2020/060554 WO 20200326
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F1/16

Abstract:
In an example, a standoff may include a bracket, a post attachable to the bracket, and a spacer removably attachable to the post. The post may include a first portion having a first diameter, and a second portion having a second diameter larger than the first diameter of the first portion of the post. The spacer may include a first portion having a first internal diameter at a first end of the spacer, and a second portion having a second internal diameter at a second end of the spacer opposite the first end, wherein the second internal diameter is larger than the first internal diameter of the first portion of the spacer.
Public/Granted literature
- US20210255673A1 STANDOFFS WITH REMOVABLE SPACERS Public/Granted day:2021-08-19
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