Invention Grant
- Patent Title: Touch sensor assembly and method of manufacturing same
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Application No.: US16721163Application Date: 2019-12-19
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Publication No.: US11182009B2Publication Date: 2021-11-23
- Inventor: Hyunki Kim , Seungje Park
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates LLP
- Priority: KR10-2014-0189144 20141224
- Main IPC: G06F3/041
- IPC: G06F3/041 ; F25D29/00 ; H03K17/96

Abstract:
A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.
Information query