Invention Grant
- Patent Title: Circuit package
-
Application No.: US16737361Application Date: 2020-01-08
-
Publication No.: US11183437B2Publication Date: 2021-11-23
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Stephen Farrar
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Trop Pruner & Hu PC
- Main IPC: B41J2/14
- IPC: B41J2/14 ; H01L23/31 ; H01L23/48 ; H01L23/00 ; H01L21/56 ; H01L23/29
Abstract:
In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.
Information query
IPC分类:
