Disclosed is a printed circuit board comprising: an integrated circuit (IC) mounted on a board plane; a power supply provided on the board plane and connected to an external power source to supply necessary power to the IC; a power plane provided in the board plane and configured to provide a main path for supplying the power from the power supply to the IC; a ground plane provided in the board plane and configured to provide a ground path corresponding to the power plane; a body mounted on the board plane by surface mount technology (SMT) and formed of an insulating material; and a conductive member disposed on the body and having one end connected to the power supply and another end connected to the IC to provide an additional power supply path in parallel with the power plane.