Invention Grant
- Patent Title: Conductive elements electrically coupled to fluidic dies
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Application No.: US16958585Application Date: 2019-04-29
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Publication No.: US11186082B2Publication Date: 2021-11-30
- Inventor: Chien-Hua Chen , Michael W Cumbie
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Austin Rapp
- International Application: PCT/US2019/029718 WO 20190429
- International Announcement: WO2020/222768 WO 20201105
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.
Public/Granted literature
- US20210252860A1 CONDUCTIVE ELEMENTS ELECTRICALLY COUPLED TO FLUIDIC DIES Public/Granted day:2021-08-19
Information query
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