Invention Grant
- Patent Title: Device and method for pressure force inspection
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Application No.: US16399430Application Date: 2019-04-30
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Publication No.: US11187602B2Publication Date: 2021-11-30
- Inventor: Yung-Chang Huang , Tsun-En Kuo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/768
- IPC: H01L21/768 ; G01L5/00 ; C25D7/12 ; G01L5/22 ; C25D17/06 ; H01L21/68 ; C25D17/00 ; H01L21/683
Abstract:
A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.
Public/Granted literature
- US20200018659A1 DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION Public/Granted day:2020-01-16
Information query
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