Invention Grant
- Patent Title: Rotating contact assemblies for self-leveling camera heads
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Application No.: US16402153Application Date: 2019-05-02
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Publication No.: US11187971B1Publication Date: 2021-11-30
- Inventor: Eric M. Chapman , Mark S. Olsson , Nicholas A. Smith , Alexander L. Warren
- Applicant: SeeScan, Inc.
- Applicant Address: US CA San Diego
- Assignee: SeeScan, Inc.
- Current Assignee: SeeScan, Inc.
- Current Assignee Address: US CA San Diego
- Agent Steven C. Tietsworth, Esq.
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G03B37/00 ; H04N5/225 ; G03B17/02

Abstract:
Electrical contact assemblies for use in rotating video camera heads are disclosed. A contact assembly may include a first element movable relative to the camera head's housing on which an imager is disposed, a second element rotationally movable relative to the first element, and a slip ring including one or more PCB brush elements to transfer imager signals to an output connector.
Information query