Invention Grant
- Patent Title: Driving chip including bonding pads in non-display area and display panel
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Application No.: US16612785Application Date: 2019-09-10
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Publication No.: US11189584B2Publication Date: 2021-11-30
- Inventor: Yantao Lu , Guanghui Liu , Chao Wang
- Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Wuhan
- Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Wuhan
- Priority: CN201910291274.3 20190411
- International Application: PCT/CN2019/105014 WO 20190910
- International Announcement: WO2020/206926 WO 20201015
- Main IPC: G02F1/13
- IPC: G02F1/13 ; H01L23/00 ; G02F1/1345 ; H01L27/32

Abstract:
A driving chip and a display panel are provided. The display panel includes the driving chip, and a plurality of first bonding pads and a plurality of second bonding pads disposed at two opposite sides of the driving chip. The driving chip includes a group of first input leads and a group of second input leads. There is an interval between the group of first input leads and the group of second input leads. The group of first input leads is disposed near the first bonding pads, and the group of second input leads is disposed near the second bonding pads.
Public/Granted literature
- US20200328172A1 DRIVING CHIP AND DISPLAY PANEL Public/Granted day:2020-10-15
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