- 专利标题: Semiconductor device and apparatus of manufacturing the same
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申请号: US16700801申请日: 2019-12-02
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公开(公告)号: US11189633B2公开(公告)日: 2021-11-30
- 发明人: Taisoo Lim , Kyungwook Park , Keun Lee , Hauk Han
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Muir Patent Law, PLLC
- 优先权: KR10-2019-0032477 20190321,KR10-2019-0085709 20190716
- 主分类号: H01L27/11582
- IPC分类号: H01L27/11582 ; H01L29/423 ; H01L21/67 ; H01L27/11565 ; H01L27/11573 ; H01L21/285 ; H01L21/3213 ; C23C16/56 ; C23C16/455 ; C23C16/06 ; H01L21/28 ; H01L21/02 ; H01L29/66
摘要:
A semiconductor device includes gate electrodes and interlayer insulating layers that are alternately stacked on a substrate, channel structures spaced apart from each other in a first direction and extending vertically through the gate electrodes and the interlayer insulating layers to the substrate, and a first separation region extending vertically through the gate electrodes and the interlayer insulating layers. Each gate electrode includes a first conductive layer and a second conductive layer, the first conductive layer disposed between the second conductive layer and each of two adjacent interlayer insulating layers. In a first region, between an outermost channel structure and the first separation region, of each gate electrode, the first conductive layer has a decreasing thickness toward the first separation region and the second conductive layer has an increasing thickness toward the first separation region.
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