Invention Grant
- Patent Title: Display substrate including signal line electrically connected to conductive pattern through the plurality of via holes
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Application No.: US16580320Application Date: 2019-09-24
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Publication No.: US11189646B2Publication Date: 2021-11-30
- Inventor: Luke Ding , Jingang Fang , Bin Zhou , Ning Liu , Guangyao Li
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Fay Sharpe LLP
- Priority: CN201811133538.4 20180927
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/027 ; H01L49/02 ; H01L29/786
Abstract:
A display substrate, a method for manufacturing the same, and a display device are disclosed. The display substrate includes: a base substrate; and a conductive pattern, a first insulating layer and a conductive layer laminated on the base substrate, wherein the first insulating layer has a plurality of first via holes, and the conductive layer includes a signal line, the signal line being electrically connected to the conductive pattern through the plurality of first via holes. The present disclosure may achieve efficient transmission of signals and ensure the display effect of the display device.
Information query
IPC分类:
