Invention Grant
- Patent Title: Method for manufacturing bent substrate and bent substrate
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Application No.: US15977396Application Date: 2018-05-11
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Publication No.: US11192815B2Publication Date: 2021-12-07
- Inventor: Makoto Fujii , Satoshi Kanasugi
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-095985 20170512
- Main IPC: C03B23/023
- IPC: C03B23/023 ; C03B23/035 ; C03B23/025

Abstract:
A method for manufacturing a bent substrate, which forms a bent part in at least a part of a substrate, in which the substrate includes a second region and a first region, the method for manufacturing including: supporting the first region of the substrate on a substrate support surface of a support member including a mold surface having a same curved surface shape as that of the bent part and the substrate support surface that supports the first region, in a state of facing the second region of the substrate to the mold surface; heating the second region of the substrate to soften the second region of the substrate by the heating; placing the second region along the mold surface of the support member by an own weight of the second region; and transferring the curved surface shape of the mold surface to the second region by an external force.
Public/Granted literature
- US20180327301A1 METHOD FOR MANUFACTURING BENT SUBSTRATE AND BENT SUBSTRATE Public/Granted day:2018-11-15
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