Invention Grant
- Patent Title: High-density FAUs and optical interconnection devices employing small diameter low attenuation optical fiber
-
Application No.: US16993810Application Date: 2020-08-14
-
Publication No.: US11194107B2Publication Date: 2021-12-07
- Inventor: Kevin Wallace Bennett , Scott Robertson Bickham , Ximao Feng , Wen-Lung Kuang , Pushkar Tandon , Ruchi Tandon , Shudong Xiao , Bryan William Wakefield , Andy Fenglei Zhou
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent Grant A. Gildehaus
- Main IPC: G02B6/02
- IPC: G02B6/02 ; G02B6/028 ; G02B6/036 ; G02B6/38 ; G02B6/40 ; G02B6/42 ; G02B6/43 ; G02B6/44 ; H04B10/80 ; G02B6/36

Abstract:
The high-density FAU comprises a support substrate having a grooved front-end section that supports glass end sections of the small diameter low-attenuation optical fibers. A cover is disposed on the front-end section and secured thereto to hold the glass end sections in place. The substrate and the cover can be made of the same glass or glasses having about the same CTE. The glass end sections have a diameter d4 so that the pitch P2 of the fibers at the front end of the FAU can be equal to or greater than d4, wherein d4=2r4, with r4 being the radius of the glass end section as defined by the optical fiber cladding. The glass end section has a radius r4 less than 45 microns, allowing for a high-density FAU and a high-density optical interconnection device.
Public/Granted literature
Information query