- 专利标题: Multi-perspective wafer analysis using an acousto-optic deflector
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申请号: US16926395申请日: 2020-07-10
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公开(公告)号: US11195267B1公开(公告)日: 2021-12-07
- 发明人: Harel Ilan , Doron Korngut , Ori Golani , Ido Almog
- 申请人: Applied Materials Israel Ltd.
- 申请人地址: IL Rehovot
- 专利权人: Applied Materials Israel Ltd.
- 当前专利权人: Applied Materials Israel Ltd.
- 当前专利权人地址: IL Rehovot
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: G06T7/00
- IPC分类号: G06T7/00 ; G01N21/95
摘要:
Disclosed herein is a computerized system including scanning equipment configured to obtain multi-perspective scan data of a slice on a sample. The scanning equipment includes: (i) a light source configured to generate a light beam; (ii) an acousto-optic deflector (AOD) configured to focus the light beam such as to generate a beam train scanned along consecutive lines on the slice, in groups of n≥2 successively scanned lines, along each of which the beam train forms at least one illumination spot, respectively; and (iii) one or more detectors configured to sense light returned from the slice. The n≥2 lines are scanned different perspectives, respectively. The consecutive lines may be longitudinally displaced relative to one another, such as to overlap in 100·(n−1)/n % of widths thereof, so that the slice may be fully scanned in each of the perspectives.
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