- 专利标题： Semiconductor device and manufacturing method thereof
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申请号： US16781703申请日： 2020-02-04
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公开(公告)号： US11195726B2公开(公告)日： 2021-12-07
- 发明人: Dong Jin Kim , Jin Han Kim , Won Chul Do , Jae Hun Bae , Won Myoung Ki , Dong Hoon Han , Do Hyung Kim , Ji Hun Lee , Jun Hwan Park , Seung Nam Son , Hyun Cho , Curtis Zwenger
- 申请人： Amkor Technology Singapore Holding Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 优先权： KR10-2015-0037481 20150318
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/683 ; H01L23/538 ; H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/56
摘要：
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
公开/授权文献
- US20200321222A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2020-10-08
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