Invention Grant
- Patent Title: Solder-creep management in high-power laser devices
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Application No.: US16028994Application Date: 2018-07-06
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Publication No.: US11196234B2Publication Date: 2021-12-07
- Inventor: Parviz Tayebati , Bien Chann , Robin Huang , Michael Deutsch
- Applicant: Parviz Tayebati , Bien Chann , Robin Huang , Michael Deutsch
- Applicant Address: US MA Sherborn; US NH Merrimack; US MA North Billerica; US NH Derry
- Assignee: Parviz Tayebati,Bien Chann,Robin Huang,Michael Deutsch
- Current Assignee: Parviz Tayebati,Bien Chann,Robin Huang,Michael Deutsch
- Current Assignee Address: US MA Sherborn; US NH Merrimack; US MA North Billerica; US NH Derry
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01S5/40
- IPC: H01S5/40 ; H01S5/14 ; H01S5/0237 ; H01S5/024
Abstract:
In various embodiments, laser apparatuses include thermal bonding layers between various components and creep-mitigation systems for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Public/Granted literature
- US20180375297A1 SOLDER-CREEP MANAGEMENT IN HIGH-POWER LASER DEVICES Public/Granted day:2018-12-27
Information query
