An electro-optical assembly comprises a substrate having a support-surface, and a photonic integrated circuit (PIC) mounted with a contact surface on the support-surface. The (PIC) comprises an integrated optical waveguide structure defining at least two waveguide end faces, at an edge surface of the PIC, perpendicular to its contact surface, and forming optical ports. An optical coupling device, mounted with a contact surface on the support-surface, optically connects at least two optical fibers to the PIC and comprises an optical waveguide structure-defining at least two front waveguide end faces provided at a front edge surface thereof, perpendicular to its contact surface. The number of front waveguide end faces corresponds to the number of the waveguide end faces. The optical coupling device is positionable during an active positioning process to align the respective waveguide end faces. A method of manufacturing such an electro-optical assembly is also provided.