Invention Grant
- Patent Title: Processing audio in multiple frequency bands with resonators
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Application No.: US16952339Application Date: 2020-11-19
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Publication No.: US11205441B2Publication Date: 2021-12-21
- Inventor: Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0137375 20171023
- Main IPC: G10L25/84
- IPC: G10L25/84 ; H04R1/24 ; H04R1/40 ; G10L17/22 ; G10L25/21 ; H04R17/02 ; H04R17/10 ; H04R1/28 ; G10L21/0388 ; H03G5/16 ; G10L21/0232 ; G10L25/18

Abstract:
Sound signal processing apparatuses and methods of operating the same are provided. The sound signal processing apparatus includes: a band separator configured to separate sound signals into frequency bands; an adder configured to add sound signals; and a signal processor that is arranged between the band separator and the adder and comprises a plurality of signal processing blocks. The band separator includes elements for separating the sound signals into frequency bands, and the elements correspond one to one to the signal processing blocks.
Public/Granted literature
- US20210074313A1 SOUND SIGNAL PROCESSING APPARATUS AND METHOD OF OPERATING THE SAME Public/Granted day:2021-03-11
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