Invention Grant
- Patent Title: Alignment of multiple image dice in package
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Application No.: US16093544Application Date: 2016-04-15
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Publication No.: US11205670B2Publication Date: 2021-12-21
- Inventor: Anton Petrus Maria Van Arendonk
- Applicant: Teledyne Digital Imaging, Inc.
- Applicant Address: CA Toronto
- Assignee: Teledyne Digital Imaging, Inc.
- Current Assignee: Teledyne Digital Imaging, Inc.
- Current Assignee Address: CA Toronto
- Agency: Ridout & Maybee LLP
- International Application: PCT/CA2016/050438 WO 20160415
- International Announcement: WO2017/177300 WO 20171019
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01L27/146 ; H01L23/544 ; H01L23/053 ; H01L21/52

Abstract:
An image sensor assembly and a method for assembling. The assembly includes: a ceramic package; at least one wall raised from the ceramic package, one of the walls for dividing a first surface region and a second surface region of the ceramic package; a frame supported by the ceramic package; a first set of fiducial markers and a second set of fiducial markers visible on the frame; a first die for placement onto the first surface region, the first die including an image sensor and respective fiducial markers for alignment with the first set of fiducial markers; a second die for placement onto the second surface region, the second die including an image sensor and respective fiducial markers for alignment with the second set of fiducial markers; and at least one optical filter each associated with one of the dice and supported by at least one of the walls.
Public/Granted literature
- US20190067351A1 ALIGNMENT OF MULTIPLE IMAGE DICE IN PACKAGE Public/Granted day:2019-02-28
Information query