An integrated circuit having a body comprised of semiconducting material has one or more electronic components formed in a first region of the body and at least another electronic component formed in the second region of the body. A thermal barrier separates the two regions. By one approach that thermal barrier comprises a gap formed in the body. The gap may comprise an air gap or may be partially or wholly filled with material that inhibits thermal conduction. The thermal barrier may at least substantially surround the aforementioned second region. The second region may also include one or more temperature sensors disposed therein. A temperature control circuit may use the corresponding temperature information from within the second region to actively control the second region temperature using a temperature forcing element that is disposed at least proximal to the second region.