- 专利标题: FPGA chip with distributed multifunctional layer structure
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申请号: US16769061申请日: 2018-01-08
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公开(公告)号: US11211933B2公开(公告)日: 2021-12-28
- 发明人: Chengli Liu , Haili Wang , Zixian Chen , Ming Ma
- 申请人: HERCULES MICROELECTRONICS CO., LTD.
- 申请人地址: CN Beijing
- 专利权人: HERCULES MICROELECTRONICS CO., LTD.
- 当前专利权人: HERCULES MICROELECTRONICS CO., LTD.
- 当前专利权人地址: CN Beijing
- 代理机构: Buchanan, Ingersoll & Rooney PC
- 优先权: CN201711332437.5 20171213
- 国际申请: PCT/CN2018/071736 WO 20180108
- 国际公布: WO2019/114070 WO 20190620
- 主分类号: H03K19/17736
- IPC分类号: H03K19/17736 ; H03K19/17796
摘要:
An FPGA chip includes one functional unit, one pre-allocation manager, and wiring segments. The functional unit includes a first module CPE and a second module PLF. The pre-allocation manager may be connected by means of one of the wiring segments. By configuring one pre-allocation manager, data transmission directions of the wiring segments may be changed. The functional unit is connected to one pre-allocation manager by means of a conventional line. The first module CPE and the second module PLF which are adjacent in the same functional unit are connected by means of a cross-connection line. The second functional modules are interconnected by means of a conventional routing system. Different functional blocks can be connected to each other from any position of a circuit.
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