Invention Grant
- Patent Title: Universal carrier for OCP modules
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Application No.: US16821741Application Date: 2020-03-17
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Publication No.: US11212933B2Publication Date: 2021-12-28
- Inventor: Yaw-Tzorng Tsorng , Shin-Ming Su , Tung-Hsien Wu , Wen-Jui Yu
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K1/18 ; H05K1/11 ; H01R12/70 ; H01R12/71

Abstract:
An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.
Public/Granted literature
- US20210120695A1 UNIVERSAL CARRIER FOR OCP MODULES Public/Granted day:2021-04-22
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