Invention Grant
- Patent Title: Deformable covers on sensors and reservoirs
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Application No.: US16612786Application Date: 2017-08-28
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Publication No.: US11215562B2Publication Date: 2022-01-04
- Inventor: Chien-Hua Chen , Michael Cumbie , Viktor Shkolnikov
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Nwamu PC
- International Application: PCT/US2017/048835 WO 20170828
- International Announcement: WO2019/045673 WO 20190307
- Main IPC: B01L3/00
- IPC: B01L3/00 ; G01N21/65 ; G01N21/62
Abstract:
Examples include a fluid device. The fluid device includes a substrate, a sensor coupled on the substrate. A reservoir is formed in the substrate adjacent to the sensor. A deformable cover is disposed to seal the sensor and the reservoir on the substrate.
Public/Granted literature
- US20200225162A1 DEFORMABLE COVERS ON SENSORS AND RESERVOIRS Public/Granted day:2020-07-16
Information query
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