Invention Grant
- Patent Title: Integrated circuit package with pre-wetted contact sidewall surfaces
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Application No.: US16825676Application Date: 2020-03-20
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Publication No.: US11217513B2Publication Date: 2022-01-04
- Inventor: Daiki Komatsu , Makoto Shibuya
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495 ; H01L23/00 ; H01L21/78 ; H01L21/66 ; H01L23/31
Abstract:
An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.
Public/Granted literature
- US20200286816A1 Integrated Circuit Package With Pre-Wetted Contact Sidewall Surfaces Public/Granted day:2020-09-10
Information query
IPC分类:
