A semiconductor package includes a first substrate having a first surface and including a first electrode, a first bump pad located on the first surface of the first substrate and connected to the first electrode, a second substrate having a second surface facing the first surface of the first substrate and including a second electrode, a second bump pad and neighboring second bump pads on the second surface of the second substrate, and a bump structure. The second bump pad has a recess structure. That is recessed from a side surface of the second bump pad toward a center thereof. The second bump pad may be connected to the second electrode. A bump structure may contact the first bump pad and the second bump pad. The bump structure may have a portion protruding through the recess structure. The neighboring second bump pads may neighbor the second bump pad and include recess structures oriented in different directions.