- 专利标题: Power module and method for manufacturing power module
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申请号: US16977172申请日: 2019-03-05
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公开(公告)号: US11217571B2公开(公告)日: 2022-01-04
- 发明人: Julien Morand , Remi Perrin , Roberto Mrad , Jeffrey Ewanchuk , Stefan Mollov
- 申请人: MITSUBISHI ELECTRIC CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人: MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: EP18305374 20180330
- 国际申请: PCT/JP2019/009551 WO 20190305
- 国际公布: WO2019/188153 WO 20191003
- 主分类号: H01L25/11
- IPC分类号: H01L25/11 ; H01L25/18 ; H01L25/00
摘要:
A power module (1) is disclosed, comprising: first and second substrates (10), each substrate patterned layer of electrically conductive material (12), a plurality of pre-packed power cells (20), positioned between the substrates, each cell comprising: an electrically insulating core (21) embedding at least one power die (22), and two external layers (23) of electrically conductive material on opposite sides of the electrically insulating core (21), said external layers being respectively connected to each patterned layers of the substrates, wherein each external layer of a pre-packed power cell comprises a contact pad (230) connected to a respective contact (220) of the power die through connections arranged in the electrically insulating core (21), said contact pad having a surface area greater than the surface area of the power die electrical contact to which it is connected.
公开/授权文献
- US20210043613A1 POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE 公开/授权日:2021-02-11
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