- 专利标题: Semiconductor laser diode light source package
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申请号: US16176453申请日: 2018-10-31
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公开(公告)号: US11217958B2公开(公告)日: 2022-01-04
- 发明人: Hong-Seok Seo , Bongki Mheen , Gyu Dong Choi
- 申请人: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 申请人地址: KR Daejeon
- 专利权人: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址: KR Daejeon
- 优先权: KR10-2017-0167759 20171207
- 主分类号: H01S3/094
- IPC分类号: H01S3/094 ; H01S5/10 ; H01S5/068 ; H01S5/024 ; H01S3/10 ; H01S5/06 ; H01S3/067 ; H01S3/0941 ; H01S3/16 ; H01S5/12 ; H01S5/062 ; H01S3/00 ; H01S5/02251
摘要:
A semiconductor laser diode light source package includes: a seed light source for outputting signal beams; a pump beam source for outputting pump beams; and at least one mirror for transmitting the signal beams to a core of an output optical fiber and transmitting the pump beams to first cladding of the output optical fiber, wherein the seed light source, the pump beam source, and the at least one mirror are realized in a semiconductor chip, and the output optical fiber is connected to an end terminal of the semiconductor laser diode light source package.
公开/授权文献
- US20190181605A1 SEMICONDUCTOR LASER DIODE LIGHT SOURCE PACKAGE 公开/授权日:2019-06-13
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