Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US16728003Application Date: 2019-12-27
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Publication No.: US11218130B2Publication Date: 2022-01-04
- Inventor: Akira Michigami , Yasumasa Taniguchi , Tsutomu Takai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-005023 20190116
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/13 ; H03H9/145 ; H03H9/10

Abstract:
An acoustic wave device includes a support substrate having a central region and a surrounding region located around the central region, a silicon oxide film that is located in the central region directly or indirectly and that has a side surface, a piezoelectric layer that is provided on the silicon oxide film and that has a first principal surface and a second principal surface, an excitation electrode provided on at least one of the first principal surface and the second principal surface, a cover film provided to cover the entire side surface of the silicon oxide film, a resin layer that is provided in the surrounding region and that is provided to cover the side surface of the silicon oxide film from above the cover film, and a wiring electrode that is electrically connected to the excitation electrode and that extends from the piezoelectric layer to the resin layer.
Public/Granted literature
- US20200228087A1 ACOUSTIC WAVE DEVICE Public/Granted day:2020-07-16
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