Invention Grant
- Patent Title: Connecting a flexible circuit to other structures
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Application No.: US16381708Application Date: 2019-04-11
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Publication No.: US11219124B2Publication Date: 2022-01-04
- Inventor: James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Alleman Hall Creasman & Tuttle LLP
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H05K3/28 ; C08K3/08 ; C08K7/00 ; C09D5/24 ; C09D183/04 ; G06F1/16 ; H01L23/538 ; H05K1/09 ; H05K3/00 ; H05K1/14
Abstract:
One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
Public/Granted literature
- US20190239351A1 CONNECTING A FLEXIBLE CIRCUIT TO OTHER STRUCTURES Public/Granted day:2019-08-01
Information query
