A mold conveyance guide apparatus includes: a linear guide that is attached along a conveyance direction of a mold to a mold attachment surface of at least one of a fixed platen or a movable platen to which the mold is fixed; a slider that is movably attached to the linear guide; and a coupling arm that is swingably attached to the slider in a direction coming closer to or separating from the mold attachment surface and is coupled to the mold in an engageable and disengageable manner.