Invention Grant
- Patent Title: Sprue-bush and method for manufacturing sprue-bush
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Application No.: US16313781Application Date: 2017-06-28
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Publication No.: US11220032B2Publication Date: 2022-01-11
- Inventor: Shinya Watanabe , Satoshi Abe , Kenichi Tanaka , Mikio Mori , Yoshiyuki Uchinono
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2016-129264 20160629
- International Application: PCT/JP2017/023811 WO 20170628
- International Announcement: WO2018/003881 WO 20180104
- Main IPC: B29C45/27
- IPC: B29C45/27 ; B22F10/20 ; B33Y80/00 ; B29C33/38 ; B33Y10/00

Abstract:
To manufacture a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a method for manufacturing a sprue-bush, wherein a shaped part is located on a base part to manufacture the sprue-bush, the base part comprising a raw resin-flow path and a cooling medium-flow path, wherein, in the shaped part, a downstream raw resin-flow path portion is located and a downstream cooling medium-flow path portion is also located, the downstream raw resin-flow path portion corresponding to a downstream side region of a raw resin-flow path of the sprue-bush, the downstream cooling medium-flow path portion being positioned around the downstream raw resin-flow path portion and corresponding to a downstream side region of a cooling medium-flow path of the sprue-bush, and wherein the downstream cooling medium-flow path portion is located to surround the downstream raw resin-flow path portion.
Public/Granted literature
- US20190224898A1 SPRUE-BUSH AND METHOD FOR MANUFACTURING SPRUE-BUSH Public/Granted day:2019-07-25
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