- 专利标题: Modulated thermal conductance thermal enclosure
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申请号: US16781133申请日: 2020-02-04
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公开(公告)号: US11223054B2公开(公告)日: 2022-01-11
- 发明人: Steven J. Eickhoff , Jeffrey Michael Klein
- 申请人: Honeywell International Inc.
- 申请人地址: US NJ Morris Plains
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morris Plains
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H01M4/02
- IPC分类号: H01M4/02 ; H01M8/04007 ; H01M8/2475
摘要:
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.
公开/授权文献
- US20200176788A1 MODULATED THERMAL CONDUCTANCE THERMAL ENCLOSURE 公开/授权日:2020-06-04
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