Invention Grant
- Patent Title: Electronic component
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Application No.: US15293700Application Date: 2016-10-14
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Publication No.: US11227715B2Publication Date: 2022-01-18
- Inventor: Akinori Hamada , Hayami Kudo , Ryo Okura , Shinji Otani
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2014-115854 20140604
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F41/04 ; H01F17/00 ; H01F27/255 ; H01F41/02 ; H01F41/10 ; H05K3/32

Abstract:
An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.
Public/Granted literature
- US20170032887A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2017-02-02
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