Invention Grant
- Patent Title: Leadframe package with pre-applied filler material
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Application No.: US15392909Application Date: 2016-12-28
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Publication No.: US11227776B2Publication Date: 2022-01-18
- Inventor: Jefferson Talledo , Frederick Ray Gomez
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L23/495 ; H05K1/11 ; H01L23/00 ; H05K1/18 ; H01L21/54 ; H01L21/78 ; H01L23/31 ; H01L21/56
Abstract:
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.
Public/Granted literature
- US20170110340A1 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL Public/Granted day:2017-04-20
Information query
IPC分类:
