- 专利标题： Through hole side wettable flank
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申请号： US16865533申请日： 2020-05-04
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公开(公告)号： US11227820B2公开(公告)日： 2022-01-18
- 发明人: Kan Wae Lam , Wai Hung William Hor , Sven Walczyk , Hans-Juergen Funke
- 申请人： NEXPERIA B.V.
- 申请人地址： NL Nijmegen
- 专利权人： NEXPERIA B.V.
- 当前专利权人： NEXPERIA B.V.
- 当前专利权人地址： NL Nijmegen
- 代理机构： Ohlandt, Greeley, Ruggiero & Perle, LLP
- 优先权： EP19172982 20190507
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L23/00
摘要：
This disclosure relates to a flank wettable semiconductor device, having: a lead frame including a plurality of leads with a lead end portion and a semiconductor die mounted on the lead frame. The lead end portion comprises a recess portion having a height that corresponds to a thickness of the lead end portion, and a plate member mounted on the leadframe at the lead end portion.
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