- 专利标题: Electronic module having improved shield performance
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申请号: US16524496申请日: 2019-07-29
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公开(公告)号: US11227840B2公开(公告)日: 2022-01-18
- 发明人: Yoshihito Otsubo , Motohiko Kusunoki
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Pearne & Gordon LLP
- 优先权: JPJP2018-146859 20180803,JPJP2019-090887 20190513
- 主分类号: H01L23/552
- IPC分类号: H01L23/552 ; H01L23/31 ; H03F3/04 ; H01L25/16 ; H01L23/498
摘要:
A module includes a substrate having a main surface, a first component mounted on the main surface, and a first wire group constituted of three or more wires in parallel with each other that are bonded to the main surface so as to straddle the first component while extending in a first direction. When sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length.
公开/授权文献
- US20200043865A1 MODULE 公开/授权日:2020-02-06
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