- 专利标题: High density electrical connectors
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申请号: US16355286申请日: 2019-03-15
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公开(公告)号: US11228130B2公开(公告)日: 2022-01-18
- 发明人: Aymeric Soudy , Cyril Jeune , Arnaud Hyppias
- 申请人: FCI USA LLC
- 申请人地址: US PA Etters
- 专利权人: FCI USA LLC
- 当前专利权人: FCI USA LLC
- 当前专利权人地址: US PA Etters
- 代理机构: Wolf, Greenfield & Sacks, P.C.
- 优先权: FR1852288 20180316
- 主分类号: H01R13/436
- IPC分类号: H01R13/436 ; H01R13/627 ; H01R13/428 ; H01R4/18
摘要:
In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
公开/授权文献
- US20190288436A1 HIGH DENSITY ELECTRICAL CONNECTORS 公开/授权日:2019-09-19
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