Invention Grant
- Patent Title: Conductive substrate, manufacturing method thereof and display device
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Application No.: US15776226Application Date: 2017-11-15
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Publication No.: US11231606B2Publication Date: 2022-01-25
- Inventor: Hongfei Cheng , Yuxin Zhang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201710154211.4 20170315
- International Application: PCT/CN2017/111047 WO 20171115
- International Announcement: WO2018/166228 WO 20180920
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; C08K3/04

Abstract:
Embodiments of the present invention provide a conductive substrate, a manufacturing method thereof and a display device. The conductive substrate includes a base substrate and a first conductive layer and a second conductive layer disposed on the base substrate, wherein the first conductive layer and the second conductive layer contact with each other, the first conductive layer is configured to be electrically connected with separated parts after the second conductive layer is fractured, and the first conductive layer includes a composite material layer or a nanowire conductive network layer.
Public/Granted literature
- US20210173250A1 CONDUCTIVE SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE Public/Granted day:2021-06-10
Information query
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