- Patent Title: Conductive resin composition and conductive structure using same
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Application No.: US17041791Application Date: 2019-03-29
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Publication No.: US11239004B2Publication Date: 2022-02-01
- Inventor: Tomohiro Fukao , Tomoaki Sawada , Takatoshi Abe
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-069000 20180330
- International Application: PCT/JP2019/013977 WO 20190329
- International Announcement: WO2019/189750 WO 20191003
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C08F220/32 ; C08K3/04 ; C08K3/08
Abstract:
A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.
Public/Granted literature
- US20210027909A1 CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE STRUCTURE USING SAME Public/Granted day:2021-01-28
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