Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
-
Application No.: US16914831Application Date: 2020-06-29
-
Publication No.: US11239367B2Publication Date: 2022-02-01
- Inventor: I-Sheng Chen , Chih Chieh Yeh , Cheng-Hsien Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/8238 ; H01L27/092 ; H01L29/786 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/45

Abstract:
A semiconductor device includes first channel layers disposed over a substrate, a first source/drain region disposed over the substrate, a gate dielectric layer disposed on each of the first channel layers, a gate electrode layer disposed on the gate dielectric. Each of the first channel layers includes a semiconductor wire made of a first semiconductor material. The semiconductor wire passes through the first source/drain region and enters into an anchor region. At the anchor region, the semiconductor wire has no gate electrode layer and no gate dielectric, and is sandwiched by a second semiconductor material.
Public/Granted literature
- US20200328300A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-10-15
Information query
IPC分类: