Invention Grant
- Patent Title: Solder sealing in high-power laser devices
-
Application No.: US16813893Application Date: 2020-03-10
-
Publication No.: US11239630B2Publication Date: 2022-02-01
- Inventor: Parviz Tayebati , Michael Deutsch
- Applicant: Parviz Tayebati , Michael Deutsch
- Applicant Address: US MA Sherborn; US NH Derry
- Assignee: Parviz Tayebati,Michael Deutsch
- Current Assignee: Parviz Tayebati,Michael Deutsch
- Current Assignee Address: US MA Sherborn; US NH Derry
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/02355 ; H01S5/40 ; H01S3/08 ; H01S5/14 ; H01S5/0237 ; H01S5/02 ; H01S5/024
Abstract:
In various embodiments, laser apparatuses include thermal bonding layers between various components and sealing materials for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Public/Granted literature
- US20200280166A1 SOLDER SEALING IN HIGH-POWER LASER DEVICES Public/Granted day:2020-09-03
Information query
