- 专利标题： Self-alignment features for III-V ridge process and angled facet die
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申请号： US16584218申请日： 2019-09-26
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公开(公告)号： US11239631B2公开(公告)日： 2022-02-01
- 发明人: Tymon Barwicz , Yves C. Martin , Jason S. Orcutt
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 Randall Bluestone
- 主分类号： H01S5/02375
- IPC分类号： H01S5/02375 ; H01S5/22 ; H01S5/0234 ; H01S5/02326 ; H01S5/042 ; H01S5/0237
摘要：
A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.