Invention Grant
- Patent Title: Circuit emulation maintaining transport overhead integrity
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Application No.: US16230849Application Date: 2018-12-21
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Publication No.: US11239932B2Publication Date: 2022-02-01
- Inventor: Raghunandan Annavajjala , Anand B. Agarwal , Onkar R. Deshpande , Christian Schmutzer
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Shendan, LLP
- Priority: IN201841042724 20181114
- Main IPC: H04J3/06
- IPC: H04J3/06 ; H04J3/16 ; H04J3/14

Abstract:
Techniques for emulating a time division multiplexed (TDM) circuit using a packet switched network are described. First and second packet nodes are installed in a communication network. The first TDM node and second TDM node form a first span in the TDM circuit. First and second fiber connections are disconnected from the first and second TDM nodes, and connected to the first and second packet nodes. A portion of TDM data transmission across the first span is emulated using a packet connection formed by the first packet node and the second packet node. The TDM data transmission includes transport overhead data, and the packet connection emulates the transport overhead data.
Public/Granted literature
- US20200153525A1 CIRCUIT EMULATION MAINTAINING TRANSPORT OVERHEAD INTEGRITY Public/Granted day:2020-05-14
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