Invention Grant
- Patent Title: Thin film capacitor and circuit board incorporating the same
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Application No.: US16665503Application Date: 2019-10-28
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Publication No.: US11240908B2Publication Date: 2022-02-01
- Inventor: Kazuhiro Yoshikawa , Yuuki Aburakawa , Tatsuo Namikawa , Kenichi Yoshida , Hitoshi Saita
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-202468 20181029,JPJP2019-187615 20191011
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H05K1/16

Abstract:
Disclosed herein is a thin film capacitor that includes a capacitive insulating film, a first metal film formed on one surface of the capacitive insulating film, and a second metal film formed on other surface of the capacitive insulating film and made of a metal material different from that of the first metal film. The thin film capacitor has an opening penetrating the capacitive insulating film, first metal film, and second metal film. The second metal film is thicker than the first metal film. A first size of a part of the opening that penetrates the first metal film is larger than a second size of a part of the opening that penetrates the second metal film.
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