Invention Grant
- Patent Title: Flexible substrate and method for manufacturing same, and flexible electronic device
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Application No.: US16623028Application Date: 2019-02-21
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Publication No.: US11240911B2Publication Date: 2022-02-01
- Inventor: Pinfan Wang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Fay Sharpe LLP
- Priority: CN201810540699.9 20180530
- International Application: PCT/CN2019/075745 WO 20190221
- International Announcement: WO2019/227981 WO 20191205
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/538 ; H05K1/11 ; H05K3/40

Abstract:
Disclosed are a flexible substrate and a method for manufacturing the same, and a flexible electronic device. The flexible substrate includes: a flexible base; a plurality of electronic components disposed on the flexible base, a first gap being formed between each two adjacent electronic components of the plurality of electronic components; and a plurality of metal lines, wherein at least one end of each of the metal lines is connected to the corresponding electronic component, at least a portion of the plurality of metal lines are disposed in the first gap, and a length of each metal line disposed in the first gap is greater than a width of the first gap in an extension direction of the metal line; wherein a first filling layer is disposed in the first gap to wrap the metal line disposed in the first gap.
Public/Granted literature
- US20210153337A1 FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND FLEXIBLE ELECTRONIC DEVICE Public/Granted day:2021-05-20
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