Invention Grant
- Patent Title: Apparatus and method for multilayer thin film thickness measurement using single-shot angle-resolved spectral reflectometry
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Application No.: US16957801Application Date: 2020-02-27
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Publication No.: US11243070B2Publication Date: 2022-02-08
- Inventor: Young-Sik Ghim , Hyug-gyo Rhee
- Applicant: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Applicant Address: KR Daejeon
- Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee: KOREA RESEARCH INSTITUTE OF STANDARDS AND SCIENCE
- Current Assignee Address: KR Daejeon
- Agency: Allen, Dyer, Doppelt + Gilchrist, P.A.
- Priority: KR10-2019-0100456 20190816
- International Application: PCT/KR2020/002816 WO 20200227
- International Announcement: WO2021/033860 WO 20210225
- Main IPC: G01J3/02
- IPC: G01J3/02 ; G01B11/06 ; G01N21/41 ; G02B27/28

Abstract:
In the embodiment in association with the present disclosure, an apparatus and method for multilayer thin film thickness measurement using single-shot angle-resolved spectral reflectometry are provided which allow simultaneously obtaining the absolute reflectance and phase data of a measurement object over a broad wavelength range and wide incident angle according to various polarization states by a single-shot measurement.
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