Invention Grant
- Patent Title: Measurement method and apparatus
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Application No.: US16615207Application Date: 2018-05-28
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Publication No.: US11243473B2Publication Date: 2022-02-08
- Inventor: Te-Sheng Wang , Qian Zhao
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- International Application: PCT/EP2018/063948 WO 20180528
- International Announcement: WO2018/224349 WO 20181213
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/86

Abstract:
A method involving obtaining a simulation of a contour of a pattern to be formed on a substrate using a patterning process, determining a location of an evaluation point on the simulated contour of the pattern, the location spatially associated with a location of a corresponding evaluation point on a design layout for the pattern, and producing electronic information corresponding to a spatial bearing between the location of the evaluation point on the simulated contour and the location of the corresponding evaluation point on the design layout, wherein the information corresponding to the spatial bearing is configured for determining a location of an evaluation point on a measured image of at least part of the pattern, the evaluation point on the measured image spatially associated with the corresponding evaluation point on the design layout.
Public/Granted literature
- US20200159124A1 MEASUREMENT METHOD AND APPARATUS Public/Granted day:2020-05-21
Information query
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