Invention Grant
- Patent Title: Printed circuit board deformable in both length and width
-
Application No.: US16448114Application Date: 2019-06-21
-
Publication No.: US11246212B2Publication Date: 2022-02-08
- Inventor: Wei-Xiang Li , Ming-Liang Zuo
- Applicant: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Applicant Address: CN Shenzhen; CN Qinhuangdao
- Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Current Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Current Assignee Address: CN Shenzhen; CN Qinhuangdao
- Agency: ScienBiziP, P.C.
- Priority: CN201610900164.9 20161014
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K3/16 ; H05K3/18 ; H05K3/40 ; H05K3/42

Abstract:
A printed circuit board deformable in both length and width includes a first conductive circuit layer, a second conductive circuit layer, an elastic film, and conductive via holes. The first conductive circuit layer includes first conductive circuits. First honeycomb holes are defined on the first conductive circuits. The second conductive circuit layer faces away from the first conductive circuit layer, the second conductive circuit layer comprises second conductive circuits, second honeycomb holes being defined on the second conductive circuits, each of the second honeycomb holes corresponds to one of the first honeycomb holes. The first conductive circuits are embedded in the elastic film. Each of the conductive via holes corresponds to one first honeycomb holes.
Public/Granted literature
- US20190306974A1 PRINTED CIRCUIT BOARD DEFORMABLE IN BOTH LENGTH AND WIDTH Public/Granted day:2019-10-03
Information query