Invention Grant
- Patent Title: Ceramic substrate and electronic component-embedded module
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Application No.: US16281269Application Date: 2019-02-21
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Publication No.: US11246215B2Publication Date: 2022-02-08
- Inventor: Ryota Asai , Yosuke Matsushita
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2016-161717 20160822
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K1/18 ; H01L25/00 ; H05K3/38 ; H01L21/56 ; H05K3/46 ; H01L21/48 ; H01L23/31 ; H01L23/498 ; H05K3/00 ; H05K3/40 ; H05K5/06 ; H01L23/29 ; H01L23/15

Abstract:
A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.
Public/Granted literature
- US20190191562A1 CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE Public/Granted day:2019-06-20
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